PDC cutters is the key cutting element of PDC bits, and its quality directly affects the cutting efficiency and service life of the bit. PDC cutters is sintered together by combining a polycrystalline diamond layer with a carbide substrate under high temperature and ultra-high pressure. The main factors affecting the quality and performance of the compact are the ratio of diamond to binder, the type of binder, the grain size of the diamond, the interface structure, and the sintering process, among others. As a professional manufacturer of PDC cutterss, Zhengzhou Bote will discuss the key factors affecting the performance of PDC cutterss.

·Binder. The PDC cutters consists of two parts: one is the diamond layer as the working body, and the other is the carbide as the substrate. The selection of the binder is crucial and should possess the following properties: good wettability to the diamond, ensuring strong adhesion; a linear expansion coefficient as close as possible to that of diamond; sufficient strength and impact toughness, and the ability to form a strong bond with the substrate; the melting point should be as low as possible to minimize damage to the diamond under high temperatures.

·Grain Size. The performance of the PDC cutters is closely related to the size of the diamond particles. Generally, diamond grain sizes can be classified into three categories: coarse, medium, and fine. As the average diamond grain size decreases, the bending strength increases, but the wear resistance decreases. Therefore, by adjusting the grain size and the ratio of coarse to fine grains, high-performance diamond compacts can be produced.

·Transition Bonding. One of the reasons for PDC bit failure is the detachment of the diamond from the substrate. The root cause is the significant difference in the expansion coefficients between the diamond and the substrate. When the temperature changes, stress is generated at the interface between the substrate and the wear-resistant layer, leading to the detachment of the diamond layer from the substrate. By adding certain materials between the diamond layer and the substrate, a gradually transitioning metallurgical bond can be formed, thereby improving the bonding strength.

·Interface Morphology. The interface between the diamond layer and the substrate often experiences delamination due to thermal stress and other reasons. Therefore, the strength of the interface bond is a critical issue. By altering the interface morphology, such as using serrated interfaces, curved interfaces, grooved interfaces, etc., the bonding strength between the two can be enhanced, significantly improving the impact toughness and shear resistance of the PDC cutters.